Die Attach Materials
(56 Части)
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ROHS
E3001
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Die Attach Materials
One Component, Silver-Filled, Electrically Conductive Epoxy Designed For Semiconductor Die Attach Applications Using A Snap-Cure Profile.
Yes
E3001-HV
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Die Attach Materials
Snap Cure, Single Component, Silver-Filled Die Attach Adhesive For Semiconductor Plastic Ic Packaging
Yes
TJ1104-LH
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Die Attach Materials
A Black, Single Component, Low Halogen, Electrically Insulating Die Attach Adhesive with Extended Pot Life
Yes
TJ1183-LH
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Die Attach Materials
A Single Component, Low-Halogen, Electrically Insulating Die Attach Adhesive with Extended Pot Life
Yes
H70E-2
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Die Attach Materials
Two Component, Thermally Conductive Electrically Insulating Epoxy Designed For Glob-Top Chip Protection In Tab and Cob Die-Attach Technologies
Yes
H65-175MP
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Die Attach Materials
Single Component, Alumina-Filled Epoxy For Military Hybrid Die and Component Attach
Yes
EPO-TEK H65-175MP
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Die Attach Materials
Single Component, Alumina-Filled Epoxy For Military Hybrid Die and Component Attach
Yes
EPO-TEK H35-175MP
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CAD
Die Attach Materials
Single Component, Silver-Filled Epoxy For Military Hybrid Die and Component Attach
Yes
E3035
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CAD
Die Attach Materials
Single Component, Silver-Filled Epoxy For Hybrid Die and Component Attach
Yes
E3001-6
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CAD
Die Attach Materials
Single Component, Electrically and Thermally Conductive, Snap Cure, Die Attach Epoxy
Yes
H24
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CAD
Die Attach Materials
Two Component, Electrically and Thermally Conductive Epoxy Adhesive Designed For Semiconductor Die Attach and Hybrid Micro-Electronics Assembly.
Yes
EK2000
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Die Attach Materials
Two Component, Silver-Filled Adhesive That Exhibits Exceptional Thermal and Electrical Conductivity Along with A Shiny Silver Appearance Making It Ideal For The Demanding Requirements Of High Power Led Die Attach Applications
Yes
H74
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CAD
Die Attach Materials
Two Component, Thermally Conductive Epoxy Designed For Hybrid Circuit Assembly Including Die Attach, Substrate Attach, Lid-Seal, Heat Dissipation, and Hermetic Sealing In General.
Yes
H35-175MPT
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CAD
Die Attach Materials
Single Component, Silver-Filled Epoxy For Military Hybrid Die and Component Attach
Yes
H35-175MPLV
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CAD
Die Attach Materials
Single Component, Silver-Filled Epoxy For Military Hybrid Die and Component Attach
Yes
H31
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CAD
Die Attach Materials
Single Component, Silver-Filled, Electrically Conductive Epoxy Designed For Semiconductor Die Attach Applications Found In Hybrids, Jedec, and Opto-Electronic Packaging.
Yes
H31LV
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CAD
Die Attach Materials
Single Component, Silver-Filled, Electrically Conductive Epoxy Designed For Semiconductor Die Attach Applications Found In Hybrids, Jedec, and Opto-Electronic Packaging
Yes
H67-MP
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CAD
Die Attach Materials
Single Component, Thermally Conductive Epoxy For Hybrid Die and Component Attach
Yes
P1011S
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Die Attach Materials
Single Component, Modified Polyimide, High Temperature Grade, Silver-Filled Electrically and Thermally Conductive Adhesive Designed For Semiconductor Die-Attach and Hybrid Microelectronic Packaging.
Yes
EM127
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CAD
Die Attach Materials
Single Component, Heat Curable, Electrically Conductive Epoxy Adhesive For Semiconductor Ic and Led Die Attach Applications.
Yes
EK1000
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CAD
Die Attach Materials
Silver-Filled Adhesive That Exhibits Exceptional Thermal and Electrical Conductivity Along with A Shiny Silver Appearance Designed For The Demanding Requirements Of High Power Led Die Attach Applications
Yes
H35-175MP
Купить
CAD
Die Attach Materials
Single Component, Silver-Filled Epoxy For Military Hybrid Die and Component Attach
Yes
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