MT57W1MH18JF-6

MT57W1MH18JF-6

Micron Technology

Description:

SRAM Chip Sync Single 1.8V 18M-bit 1M x 18 0.5ns 165-Pin FBGA Tray

Introduction date:

Oct 12, 2001

Updated:04-DEC-2024

Overview

Familiarize yourself with the fundamental general information, properties, and characteristics of the component, along with its compliance with industry standards and regulations.

LifeCyclePremium
EU RoHS No
RoHS Version2011/65/EU, 2015/863
3A991.b.2.a
Automotive No
Supplier Cage Code6Y440
8542320041
Schedule B8542320040
PPAP No
AEC Qualified No
Category Path
Semiconductor > Memory > Memory Chips > SRAM Chip

Datasheet

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Datasheet Preview

(Latest Version)

Manufacturing

The manufacturing information specifies the technical requirements and specifications for producing and assembling the component. This information is crucial for manufacturers to maintain the quality and reliability of the components, and ensure they are compatible with other devices and components.

Reflow Temp. Source
Number of Wave Cycles

Parametric

The parametric information displays vital features and performance metrics of the component, which helps engineers and supply chain managers to compare and choose the most appropriate electronic component for their applications and needs.

Product Line
Minimum Storage Temperature
Supplier Temperature Grade
Read Latency
Burst Length
Function
Process Technology
Maximum Cycle Time
I/O Mode
Number of I/O Lines
Maximum Storage Temperature
Density
Timing Type
Architecture
Data Rate Architecture
Maximum Clock Rate
Maximum Access Time
Number of Ports
Number of Words
Number of Bits per Word
Typical Operating Supply Voltage
Minimum Operating Supply Voltage
Maximum Operating Supply Voltage
Maximum Operating Current
Address Bus Width
Density in Bits
Minimum Operating Temperature
Maximum Operating Temperature

Crosses

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