MT29F8G08BACWG

MT29F8G08BACWG

Micron Technology

Description:

NAND Flash Parallel 3.3V 8G-bit 1G x 8 18ns 48-Pin TSOP-I Tray

Introduction date:

May 11, 2005

Updated:11-DEC-2024

Overview

Familiarize yourself with the fundamental general information, properties, and characteristics of the component, along with its compliance with industry standards and regulations.

LifeCyclePremium
EU RoHS No
RoHS Version2011/65/EU, 2015/863
3A991.b.1.a
Automotive No
Supplier Cage Code6Y440
8542320071
Schedule B8542320070
PPAP No
AEC Qualified No
Category Path
Semiconductor > Memory > Memory Chips > Flash

Datasheet

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Manufacturing

The manufacturing information specifies the technical requirements and specifications for producing and assembling the component. This information is crucial for manufacturers to maintain the quality and reliability of the components, and ensure they are compatible with other devices and components.

Reflow Temp. Source

Crosses

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