H5PS5162FFR-G7C

H5PS5162FFR-G7C

SK hynix Inc

Description:

DRAM Chip DDR2 SDRAM 512Mbit 32Mx16 1.8V 84-Pin FBGA

Introduction date:

Mar 1, 2008

Updated:+90 days

Overview

Familiarize yourself with the fundamental general information, properties, and characteristics of the component, along with its compliance with industry standards and regulations.

LifeCyclePremium
EU RoHS Yes
RoHS Version2002/95/EC
Category Path
Semiconductor > Memory > Memory Chips > DRAM Chip

Datasheet

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Manufacturing

The manufacturing information specifies the technical requirements and specifications for producing and assembling the component. This information is crucial for manufacturers to maintain the quality and reliability of the components, and ensure they are compatible with other devices and components.

Reflow Temp. Source
Wave Temp. Source

Parametric

The parametric information displays vital features and performance metrics of the component, which helps engineers and supply chain managers to compare and choose the most appropriate electronic component for their applications and needs.

Product Line
Maximum Refresh Cycle Time
Process Technology
Supplier Temperature Grade
Number of I/O Lines
Operating Supply Voltage
Number of Bits per Word
Minimum Storage Temperature
Maximum Storage Temperature
Refresh Cycles
Density
Type
Interface Type
Organization
Maximum Clock Rate
Maximum Access Time
Number of Internal Banks
Number of Words per Bank
Typical Operating Supply Voltage
Minimum Operating Supply Voltage
Maximum Operating Supply Voltage
Minimum Operating Temperature
Maximum Operating Temperature
Data Bus Width
Address Bus Width
Maximum Operating Current
Density in Bits

Crosses

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