High-density 32GB eMMC NAND flash memory in a 153-ball FBGA package, featuring a parallel interface and up to 400MB/s transfer speed. Operates over an extended industrial temperature range of -40°C to +85°C with 3.3V supply and 1.8V I/O voltage. Designed for automotive-grade reliability, supporting long-term availability and robust performance in demanding environments.
PackageFBGA
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Technical Specifications
SK Hynix H26M64208EMR technical specifications.
General
| Max Operating Temperature | 85 |
| Number of Terminals | 153 |
| Min Operating Temperature | -40 |
| Terminal Position | BOTTOM |
| JEDEC Package Code | R-PBGA-B153 |
| Width | 11.5mm |
| Length | 13mm |
| Height | 1.0mm |
| Number of Functions | 1 |
| Supply Voltage-Nom (Vsup) | 3.3 |
| Supply Voltage-Max (Vsup) | 3.6 |
| Supply Voltage-Min (Vsup) | 2.7 |
| Number of Words | 34359738368 |
| Number of Words Code | 32000000000 |
| Memory IC Type | FLASH |
| Parallel/Serial | PARALLEL |
| Density | 32GB |
| Product Grade | IT |
| VCCQ | 1.8V |
| Package Type | FBGA |
| Automotive | Yes |
| Chip Type | 153FBGA |
Compliance
| RoHS | Yes |
| REACH | Compliant |
| Military Spec | False |
Datasheet
SK Hynix H26M64208EMR Datasheet
Download the complete datasheet for SK Hynix H26M64208EMR to view detailed technical specifications.
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