
EDFA232A1MA-GD-F-ES-D
Micron TechnologyDescription: | LPDDR3 16G 512MX32 FBGA QDP |
Updated: +90 days | |
See more DRAM Chip by Micron Technology |
Online version:https://www.datasheets.com/part-details/edfa232a1ma-gd-f-es-d-micron-technology-1850707988
Overview
Familiarize yourself with the fundamental general information, properties, and characteristics of the component, along with its compliance with industry standards and regulations.
Semiconductor > Memory > Memory Chips > DRAM Chip
Package
The package information for the component gives important details about the product's size, weight, and packaging. This helps engineers determine if the product meets their requirements and expectations.
You must login to view the restricted information.
Manufacturing
The manufacturing information specifies the technical requirements and specifications for producing and assembling the component. This information is crucial for manufacturers to maintain the quality and reliability of the components, and ensure they are compatible with other devices and components.