DPP101Z000

DPP101Z000

TE Connectivity

Description:

MS5637 Board Mount Pressure Sensor Development Board

Country of Origin:

China

Introduction date:

Jun 19, 2015

Updated:20-NOV-2024

Overview

Familiarize yourself with the fundamental general information, properties, and characteristics of the component, along with its compliance with industry standards and regulations.

LifeCyclePremium
EU RoHS Yes
RoHS Version2011/65/EU, 2015/863
EAR99
Automotive No
Supplier Cage CodeSSCM6
9026204000
Schedule B9026200000
PPAP No
AEC Qualified No
Category Path
Semiconductor > Development Systems > Evaluation, Development Boards and Kits > Sensor Development Boards and Kits

Datasheet

Get a comprehensive understanding of the electronic component by downloading its datasheet. This PDF document includes all the necessary details, such as product overview, features, specifications, ratings, diagrams, applications, and more.

Datasheet Preview

(Latest Version)

Manufacturing

The manufacturing information specifies the technical requirements and specifications for producing and assembling the component. This information is crucial for manufacturers to maintain the quality and reliability of the components, and ensure they are compatible with other devices and components.

Reflow Temp. Source
Wave Temp. Source
Number of Wave Cycles

Parametric

The parametric information displays vital features and performance metrics of the component, which helps engineers and supply chain managers to compare and choose the most appropriate electronic component for their applications and needs.

Product Line
Product Weight
Compatible External Board
Tradename
Type
Supported Device
Supported Device Technology
Interface Type
Operating Systems
IDE
Operating Supply Voltage Range
Minimum Operating Temperature
Maximum Operating Temperature
Product Length
Product Width

Crosses

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