MSCMMX6DZDK08AB1G0A
NXP Semiconductors描述: | SOC i.MX 6Dual ARM Cortex A9 500-Pin BGA |
推出日期: | Feb 24, 2016 |
更新:+90 天 | |
在线版本:https://www.datasheets.com/zh-cn/part-details/mscmmx6dzdk08ab1g0a-nxp-semiconductors-407780765
概述
熟悉该组件的基本一般信息、属性和特征，以及其与行业标准和法规的符合情况。
生命周期高级
欧盟RoHS Unknown
RoHS版本2011/65/EU
类别路径
Semiconductor > Embedded Controllers and Systems > Embedded Systems > Application Processors and SOCs
Semiconductor > Embedded Controllers and Systems > Embedded Systems > Application Processors and SOCs
技术资料
通过下载该电子元件的数据手册来全面了解其。这个PDF文档包含了所有必要的细节，如产品概述、特性、规格、评级、图表、应用等等。
数据表预览
(Latest 版本)参数
参数信息显示了该组件的重要特性和性能指标，这有助于工程师和供应链经理比较和选择最适合其应用和需求的电子组件。
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生产线
Minimum Storage Temperature
PWM
Maximum Storage Temperature
Watchdog
Maximum Power Dissipation
Data Memory Size
Maximum Expanded Memory Size
Supplier Temperature Grade
Temperature Flag
Tradename
ISM Band
Solutions
Supported PMIC Devices
Data Cache Size
Instruction Cache Size
Display Interface
PCI
External Memory Interface
External Memory Speed
Family Name
类型
Core Architecture
Device Core
Maximum Clock Rate
Data Bus Width
Maximum Speed
Program Memory Type
Program Memory Size
Minimum Operating Supply Voltage
RAM Size
Number of ADCs
ADC Channels
ADC Resolution
Number of DACs
DAC Channels
DAC Resolution
Typical Operating Supply Voltage
Maximum Operating Supply Voltage
Number of Programmable I/Os
Application
Processing Unit
Ethernet Interface Type
Ethernet Speed
Interface Type
SPI
I2C
I2S
UART
USB
USART
CAN
Ethernet
Number of Timers
Programmability
Process Technology
Minimum Operating Temperature
Maximum Operating Temperature