XH9960
NAMICS CORPORATION| Description: | Die Attach Material Product |
Updated: 21-NOV-2024 | |
Online version:https://www.datasheets.com/part-details/xh9960-namics-corporation-1848675135
Overview
Familiarize yourself with the fundamental general information, properties, and characteristics of the component, along with its compliance with industry standards and regulations.
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Category Path
Materials and Chemicals > Materials, Chemicals and Adhesives > Semiconductor Assembly > Die Attach Materials
Materials and Chemicals > Materials, Chemicals and Adhesives > Semiconductor Assembly > Die Attach Materials
Parametric
The parametric information displays vital features and performance metrics of the component, which helps engineers and supply chain managers to compare and choose the most appropriate electronic component for their applications and needs.
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Product Line
Type
Electrical Conductivity
Film Thickness
Thermal Conductivity