TC260EBH

TC260EBH

Toshiba

Description:

TC260E Low-Height I/O Base Arrays

Introduction date:

Mar 3, 2003

Updated:20-NOV-2024

Overview

Familiarize yourself with the fundamental general information, properties, and characteristics of the component, along with its compliance with industry standards and regulations.

LifeCyclePremium
EU RoHS Unknown
RoHS Version2002/95/EC
Category Path
Semiconductor > Programmable Devices > Programmable Logic Devices > ASICs

Datasheet

Get a comprehensive understanding of the electronic component by downloading its datasheet. This PDF document includes all the necessary details, such as product overview, features, specifications, ratings, diagrams, applications, and more.

Datasheet Preview

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Manufacturing

The manufacturing information specifies the technical requirements and specifications for producing and assembling the component. This information is crucial for manufacturers to maintain the quality and reliability of the components, and ensure they are compatible with other devices and components.

Reflow Temp. Source
Wave Temp. Source

Parametric

The parametric information displays vital features and performance metrics of the component, which helps engineers and supply chain managers to compare and choose the most appropriate electronic component for their applications and needs.

Product Line
Programmability
Minimum Storage Temperature
Maximum Storage Temperature
Supplier Temperature Grade
Temperature Flag
Maximum Power Dissipation
Maximum Supply Current
Maximum Quiescent Current
Number of Raw Gates
Type
Number of Layers
Number of User I/Os
Usable Gates Range
Number of Pads
Maximum Operating Frequency
Typical Internal Gate Propagation Delay Time
Power Supply Type
Minimum Single Supply Voltage
Typical Single Supply Voltage
Maximum Single Supply Voltage
Minimum Dual Supply Voltage
Typical Dual Supply Voltage
Maximum Dual Supply Voltage
Process Technology
Minimum Operating Temperature
Maximum Operating Temperature

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