RN1903FE(TE85L,F)

RN1903FE(TE85L,F)

Toshiba
Description:

Trans Digital BJT NPN 50V 0.1mA 100mW 6-Pin ES T/R

Introduction date:Jan 9, 2003

Updated: +90 days

Overview

Familiarize yourself with the fundamental general information, properties, and characteristics of the component, along with its compliance with industry standards and regulations.

LifeCyclePremium
EU RoHS Yes
RoHS Version2011/65/EU, 2015/863
EAR99
Automotive No
Supplier Cage CodeJ2925
8541210075
Schedule B8541210080
PPAP No
AEC Qualified No
Category Path
Semiconductor > Diodes, Transistors and Thyristors > Bipolar Transistors > Digital BJT - Pre-Biased

Datasheet

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Package

The package information for the component gives important details about the product's size, weight, and packaging. This helps engineers determine if the product meets their requirements and expectations.

Supplier Package
Basic Package Type
Pin Count
Lead Shape
PCB
Package Diameter (mm)
Package Overall Length (mm)
Package Overall Width (mm)
Package Overall Height (mm)
Mounting
Package Weight (g)
Package Material
Package/Case
Package Description
Package Family Name
Jedec
Package Outline
Maximum PACKAGE_DIMENSION_H
Minimum PACKAGE_DIMENSION_H
Maximum PACKAGE_DIMENSION_L
Minimum PACKAGE_DIMENSION_L
Maximum PACKAGE_DIMENSION_W
Minimum PACKAGE_DIMENSION_W
Maximum Diameter
Minimum Diameter
Maximum Seated_Plane_Height
Minimum Seated_Plane_Height

Manufacturing

The manufacturing information specifies the technical requirements and specifications for producing and assembling the component. This information is crucial for manufacturers to maintain the quality and reliability of the components, and ensure they are compatible with other devices and components.

Reflow Temp. Source
Wave Temp. Source
Lead Finish(Plating)
Terminal Base Material
Shelf Life Period
Shelf Life Condition
Under Plating Porosity Free
Number of Wave Cycles

CAD Models

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