M378B2873FH0-CF8

M378B2873FH0-CF8

Samsung Electronics

Description:

DRAM Module DDR3 SDRAM 1Gbyte 240UDIMM

Introduction date:

Dec 15, 2010

Updated:15-NOV-2024

Overview

Familiarize yourself with the fundamental general information, properties, and characteristics of the component, along with its compliance with industry standards and regulations.

LifeCyclePremium
EU RoHS Yes
RoHS Version2011/65/EU, 2015/863
Category Path
Semiconductor > Memory > Memory Cards and Modules > Memory Modules

Datasheet

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Manufacturing

The manufacturing information specifies the technical requirements and specifications for producing and assembling the component. This information is crucial for manufacturers to maintain the quality and reliability of the components, and ensure they are compatible with other devices and components.

Parametric

The parametric information displays vital features and performance metrics of the component, which helps engineers and supply chain managers to compare and choose the most appropriate electronic component for their applications and needs.

Product Line
Warranty
Process Technology
Maximum Refresh Cycle Time
Minimum Storage Temperature
Module Sides
PLL
Number of Module Banks
SPD EEPROM Support
Number of Chip Banks
PC Type
Maximum Storage Temperature
Refresh Cycles
Self Refresh
Total Density in Bits
Supplier Temperature Grade
Main Category
Total Density
Subcategory
Maximum Clock Rate
Maximum Access Time
Organization
Number of Chip per Module
Chip Density
Module Type
Data Bus Width
Chip Configuration
ECC Support
Number of Ranks
Chip Package Type
Typical Operating Supply Voltage
Minimum Operating Supply Voltage
Maximum Operating Supply Voltage
Maximum Operating Current
CAS Latency
Minimum Operating Temperature
Maximum Operating Temperature

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