Description: | Mold Compound Material |
Updated:17-NOV-2024 | |
Online version:https://www.datasheets.com/part-details/gr-646-hysol-huawei-electronics-co---ltd-424433129
Overview
Familiarize yourself with the fundamental general information, properties, and characteristics of the component, along with its compliance with industry standards and regulations.
LifeCyclePremium
EAR99
Automotive Unknown
Supplier Cage CodeCage Code Not Available
AEC Qualified Unknown
Category Path
Materials and Chemicals > Materials, Chemicals and Adhesives > Materials > Molding Compounds
Materials and Chemicals > Materials, Chemicals and Adhesives > Materials > Molding Compounds
Parametric
The parametric information displays vital features and performance metrics of the component, which helps engineers and supply chain managers to compare and choose the most appropriate electronic component for their applications and needs.
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Product Line
Thermal Conductivity
Flash Point
VOC Content
Odor
Density
Specific Gravity
Water Absorption
Melt Mass Flow Rate
Drying Temperature
Drying Time
Flexural Modulus @ 23C
Notched Izod Impact @ 23C
Notched Charpy Impact @ 23C
Dielectric Strength
Flow Molding Shrinkage
Across Flow Molding Shrinkage
Melt Temperature
Molding Process
Form
Color
Material
Filler
Durometer
Molding Temperature
Minimum Shore Hardness
Typical Shore Hardness
Maximum Shore Hardness
Viscosity
Tensile Strength
Elongation