BB170-C
BusBoard Prototype SystemsDescription: | POM Plastic 170 Tie Point Breadboard |
Country of Origin: | China |
Introduction date: | Sep 14, 2016 |
Updated:15-DEC-2024 | |
Online version:https://www.datasheets.com/part-details/bb170-c-busboard-prototype-systems-78582047
Overview
Familiarize yourself with the fundamental general information, properties, and characteristics of the component, along with its compliance with industry standards and regulations.
LifeCyclePremium
EU RoHSNot Required
RoHS Version2011/65/EU, 2015/863
EAR99
Automotive Unknown
Supplier Cage CodeL9701
8537109150
Schedule B8537109050
AEC Qualified Unknown
Category Path
Semiconductor > Development Systems > Prototyping Boards > Solderless Breadboards
Semiconductor > Development Systems > Prototyping Boards > Solderless Breadboards
Datasheet
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