Datasheets
AR9350-DC3B

AR9350-DC3B

QUALCOMM

Description:

QCA9350D CHIPSET 2X2 DB AP-SOC CPU + MII/RMII/RGMII/PCIE/USB + 2X2 DB WLAN, x32 DRAM, NAND, Enterprise Version (Cu) I-TEMP

Updated:14-NOV-2024

See more 802.11 Wireless LAN by QUALCOMM
Part SpecificationsPrice & Availability

Overview

Familiarize yourself with the fundamental general information, properties, and characteristics of the component, along with its compliance with industry standards and regulations.

LifeCyclePremium
EU RoHS Yes
RoHS Version2011/65/EU, 2015/863
Category Path
Semiconductor > RF and Microwave > RF Modules > 802.11 Wireless LAN

Manufacturing

The manufacturing information specifies the technical requirements and specifications for producing and assembling the component. This information is crucial for manufacturers to maintain the quality and reliability of the components, and ensure they are compatible with other devices and components.

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