MSP430FR69891IPNR

MSP430FR69891IPNR

Texas Instruments

Description:

MCU 16-bit MSP430 RISC 128KB Flash 2.5V/3.3V 80-Pin LQFP T/R

Country of Origin:

Taiwan

Introduction date:

Aug 27, 2014

Updated:25-MAY-2024

Overview

Familiarize yourself with the fundamental general information, properties, and characteristics of the component, along with its compliance with industry standards and regulations.

LifeCyclePremium
EU RoHS Yes
RoHS Version2011/65/EU, 2015/863
Automotive No
Supplier Cage Code01295
8542310001
Schedule B8542310020
PPAP No
AEC Qualified No
Category Path
Semiconductor > Microcontrollers and Processors > Microcontrollers > Microcontrollers - MCUs

Datasheet

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Datasheet Preview

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Package

The package information for the component gives important details about the product's size, weight, and packaging. This helps engineers determine if the product meets their requirements and expectations.

Basic Package Type
Package Family Name
Supplier Package
Package Description
Lead Shape
Pin Count
PCB
Package Diameter (mm)
Package Weight (g)
Package Material
Mounting
Package Outline
Package Overall Height (mm)
Package Overall Width (mm)
Package Overall Length (mm)
Jedec
Jedec info (PKG outline)

Manufacturing

The manufacturing information specifies the technical requirements and specifications for producing and assembling the component. This information is crucial for manufacturers to maintain the quality and reliability of the components, and ensure they are compatible with other devices and components.

Parametric

The parametric information displays vital features and performance metrics of the component, which helps engineers and supply chain managers to compare and choose the most appropriate electronic component for their applications and needs.

Product Line
Tradename
LIN
Maximum Power Consumption
Maximum Supply Current
Number of Cores
Power On Reset
Memory Protection Unit
Temperature Sensor
DDR
Memory Management Unit
Integrated Development Environment
Super Scalar
External Bus Interface
Hardware Acceleration
Trace Hardware
Maximum Dhrystone MIPS
Encryption Standard
DMA Channels
CAN Type
EEPROM
Instruction Cache Size
Data Cache Size
Direct Memory Access
Floating Point Unit
Bluetooth
Wi-Fi
Timers Resolution
Multiply Accumulate
Input Capture Channels
Output Compare Channels
Internal/External Clock Type
Touch Sensing Interface
Solutions
ISM Band
Ethernet Interface Type
Ethernet Speed
Process Technology
Special Features
Maximum Power Dissipation
Display Driver
Data Memory Size
Analog Comparators
Watchdog
PWM
LCD Segments
Minimum Storage Temperature
Maximum Storage Temperature
Maximum Expanded Memory Size
Operating Supply Voltage
Supplier Temperature Grade
Parallel Master Port
Real Time Clock
Timers Channels
Temperature Flag
Family Name
Core Architecture
Device Core
Data Bus Width
Instruction Set Architecture
Maximum Clock Rate
Maximum CPU Frequency
Program Memory Type
Program Memory Size
RAM Size
Number of ADCs
ADC Channels
ADC Resolution
Number of DACs
DAC Channels
DAC Resolution
Number of Timers
Number of Programmable I/Os
Minimum Operating Supply Voltage
Typical Operating Supply Voltage
Maximum Operating Supply Voltage
Interface Type
CAN
I2C
SPI
Ethernet
UART
USART
USB
I2S
Programmability
Minimum Operating Temperature
Maximum Operating Temperature

CAD Models

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