H11L1SM

H11L1SM

onsemi

Description:

Optocoupler Logic-Out Open Collector DC-IN 1-CH 6-Pin PDIP SMD Bag

Country of Origin:

China

Introduction date:

Nov 2, 2001

Updated:05-NOV-2024

Ref. Designs

Overview

Familiarize yourself with the fundamental general information, properties, and characteristics of the component, along with its compliance with industry standards and regulations.

LifeCyclePremium
EU RoHS Yes
RoHS Version2011/65/EU, 2015/863
EAR99
Automotive No
Supplier Cage Code1MQ07
8541498000
Schedule B8541498000
PPAP No
AEC Qualified No
Category Path
Optoelectronics, Lighting and Displays > Optoelectronics > PhotoCouplers > Logic Output Photocouplers

Datasheet

Get a comprehensive understanding of the electronic component by downloading its datasheet. This PDF document includes all the necessary details, such as product overview, features, specifications, ratings, diagrams, applications, and more.

Datasheet Preview

(Latest Version)

Package

The package information for the component gives important details about the product's size, weight, and packaging. This helps engineers determine if the product meets their requirements and expectations.

Basic Package Type
Package Family Name
Supplier Package
Package Description
Lead Shape
Pin Count
PCB
Package Diameter (mm)
Package Weight (g)
Package Material
Mounting
Package Outline
Package Overall Height (mm)
Package Overall Width (mm)
Package Overall Length (mm)
Jedec

Manufacturing

The manufacturing information specifies the technical requirements and specifications for producing and assembling the component. This information is crucial for manufacturers to maintain the quality and reliability of the components, and ensure they are compatible with other devices and components.

Reflow Temp. Source

Parametric

The parametric information displays vital features and performance metrics of the component, which helps engineers and supply chain managers to compare and choose the most appropriate electronic component for their applications and needs.

Product Line
Typical Forward Voltage
Minimum Current Transfer Ratio
Typical Fall Time
Maximum Rise Time
Typical Rise Time
Maximum Propagation Delay Time
Maximum Power Dissipation
Minimum Forward Voltage
Maximum Continuous Output Current
Minimum Forward Current
Maximum Forward Voltage
Minimum Supply Voltage
Minimum Storage Temperature
Maximum Reverse Voltage
Maximum Storage Temperature
Process Technology
Supplier Temperature Grade
Current Transfer Ratio Test Current
Maximum Working Insulation Voltage
Maximum Propagation Delay Time (tPLH)
Maximum Propagation Delay Time (tPHL)
Common Mode Voltage
Maximum Supply Voltage
Minimum Common Mode Rejection
Maximum Pulse Width Distortion
Maximum Propagation Delay Skew
Input Type
Output Type
Number of Channels per Chip
Polarity
Direction Type
Minimum Isolation Voltage
Logic Gate Type
Minimum Operating Temperature
Maximum Operating Temperature
Maximum Current Transfer Ratio
Maximum Data Rate
Maximum Fall Time
Maximum Forward Current

Reference designs

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