H11A817A3S

H11A817A3S

onsemi

Description:

DC-IN 1-CH Transistor DC-OUT 4-Pin PDIP SMD Black

Country of Origin:

Thailand

Introduction date:

Jan 6, 1997

Updated:+90 days

Overview

Familiarize yourself with the fundamental general information, properties, and characteristics of the component, along with its compliance with industry standards and regulations.

LifeCyclePremium
EU RoHS Yes
RoHS Version2011/65/EU, 2015/863
EAR99
Automotive No
Supplier Cage Code1MQ07
8541498000
Schedule B8541498000
PPAP No
AEC Qualified No
Category Path
Optoelectronics, Lighting and Displays > Optoelectronics > PhotoCouplers > Transistor and Photovoltaic Output Photocouplers

Datasheet

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Datasheet Preview

(Latest Version)

Package

The package information for the component gives important details about the product's size, weight, and packaging. This helps engineers determine if the product meets their requirements and expectations.

Basic Package Type
Package Family Name
Supplier Package
Package Description
Lead Shape
Pin Count
PCB
Package Diameter (mm)
Package Weight (g)
Package Material
Mounting
Jedec

Manufacturing

The manufacturing information specifies the technical requirements and specifications for producing and assembling the component. This information is crucial for manufacturers to maintain the quality and reliability of the components, and ensure they are compatible with other devices and components.

Reflow Temp. Source
Wave Temp. Source

Parametric

The parametric information displays vital features and performance metrics of the component, which helps engineers and supply chain managers to compare and choose the most appropriate electronic component for their applications and needs.

Product Line
Current Transfer Ratio Test Current
Minimum Input Reverse Breakdown Voltage
Process Technology
Maximum Data Rate
Minimum Forward Voltage
Supplier Temperature Grade
Minimum Storage Temperature
Maximum Storage Temperature
Maximum Propagation Delay Time (tPHL)
Maximum Propagation Delay Time (tPLH)
Minimum Common Mode Rejection
Common Mode Voltage
Maximum Supply Voltage
Maximum Working Insulation Voltage
Typical Bandwidth
Typical Rise Time
Typical Fall Time
Minimum Collector Emitter Voltage
Typical Forward Voltage
Maximum Forward Current
Input Type
Output Type
Output Device
Number of Channels per Chip
Minimum Isolation Voltage
Maximum Forward Voltage
Maximum Collector-Emitter Voltage
Maximum Current Transfer Ratio
Maximum Collector Current
Maximum Collector-Emitter Saturation Voltage
Maximum Power Dissipation
Maximum Reverse Voltage
Maximum Rise Time
Maximum Fall Time
Minimum Operating Temperature
Maximum Operating Temperature
Minimum Current Transfer Ratio

CAD Models

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