72V273L7-5PFGI

72V273L7-5PFGI

Renesas Electronics

Description:

FIFO Mem Sync Dual Depth/Width Uni-Dir 16K x 18/32K x 9 80-Pin TQFP Tray

Country of Origin:

Taiwan (Province of China)

Introduction date:

Dec 18, 2000

Updated:15-NOV-2024

Overview

Familiarize yourself with the fundamental general information, properties, and characteristics of the component, along with its compliance with industry standards and regulations.

LifeCyclePremium
EU RoHS Yes
RoHS Version2011/65/EU, 2015/863
Category Path
Semiconductor > Memory > Memory Chips > FIFOs Memory

Datasheet

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Manufacturing

The manufacturing information specifies the technical requirements and specifications for producing and assembling the component. This information is crucial for manufacturers to maintain the quality and reliability of the components, and ensure they are compatible with other devices and components.

Reflow Temp. Source

Parametric

The parametric information displays vital features and performance metrics of the component, which helps engineers and supply chain managers to compare and choose the most appropriate electronic component for their applications and needs.

Product Line
Process Technology
Supplier Temperature Grade
Programmability
Minimum Storage Temperature
Maximum Storage Temperature
Density
Timing Type
Bus Directional
Organization
Maximum Clock Rate
Maximum Access Time
Configuration
Expansion Support
Expansion Type
FWFT Support
Retransmit Capability
Typical Operating Supply Voltage
Minimum Operating Supply Voltage
Maximum Operating Supply Voltage
Data Bus Width
Maximum Operating Current
Density in Bits
Minimum Operating Temperature
Maximum Operating Temperature

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