1321XCSK-BDM

1321XCSK-BDM

NXP Semiconductors

Description:

MC13211/MC13212/MC13213 802.15.4 LR-WPAN Starter Kit

Introduction date:

Oct 2, 2008

Updated:25-NOV-2024

Overview

Familiarize yourself with the fundamental general information, properties, and characteristics of the component, along with its compliance with industry standards and regulations.

LifeCyclePremium
EU RoHS Yes
RoHS Version2011/65/EU, 2015/863
5A002
Automotive No
Supplier Cage CodeH2J65
8471500150
Schedule B8471500150
PPAP No
AEC Qualified No
Category Path
Semiconductor > Development Systems > Evaluation, Development Boards and Kits > RF/Wireless Development Boards and Kits

Datasheet

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Datasheet Preview

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Manufacturing

The manufacturing information specifies the technical requirements and specifications for producing and assembling the component. This information is crucial for manufacturers to maintain the quality and reliability of the components, and ensure they are compatible with other devices and components.

Shelf Life Period
Under Plating Porosity Free

Crosses

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