MPC8543HXAQG

MPC8543HXAQG

NXP Semiconductors
Description:

MPU PowerQUICC III RISC 32bit 0.09um 1GHz 1.8V/2.5V/3.3V 783-Pin FCCBGA Tray

Introduction date:May 1, 2007

Updated: 12-FEB-2025

Overview

Familiarize yourself with the fundamental general information, properties, and characteristics of the component, along with its compliance with industry standards and regulations.

LifeCyclePremium
EU RoHS No
RoHS Version2011/65/EU, 2015/863
5A992
Automotive No
Supplier Cage CodeH2J65
8542310045
Schedule B8542310045
PPAP No
AEC Qualified No
Category Path
Semiconductor > Microcontrollers and Processors > Processors > Microprocessors - MPUs

Datasheet

Get a comprehensive understanding of the electronic component by downloading its datasheet. This PDF document includes all the necessary details, such as product overview, features, specifications, ratings, diagrams, applications, and more.

Package

The package information for the component gives important details about the product's size, weight, and packaging. This helps engineers determine if the product meets their requirements and expectations.

Supplier Package
Basic Package Type
Pin Count
Lead Shape
PCB
Package Diameter (mm)
Package Overall Length (mm)
Package Overall Width (mm)
Package Overall Height (mm)
Mounting
Package Weight (g)
Package Material
Package Description
Package Family Name
Jedec
Package Outline
Maximum PACKAGE_DIMENSION_H
Minimum PACKAGE_DIMENSION_H
Maximum PACKAGE_DIMENSION_L
Minimum PACKAGE_DIMENSION_L
Maximum PACKAGE_DIMENSION_W
Minimum PACKAGE_DIMENSION_W
Maximum Diameter
Minimum Diameter
Maximum Seated_Plane_Height
Minimum Seated_Plane_Height
Jedec info (PKG outline)

Manufacturing

The manufacturing information specifies the technical requirements and specifications for producing and assembling the component. This information is crucial for manufacturers to maintain the quality and reliability of the components, and ensure they are compatible with other devices and components.

Reflow Temp. Source
Wave Temp. Source
Lead Finish(Plating)
Terminal Base Material
Shelf Life Period
Shelf Life Condition
Under Plating Porosity Free
Number of Wave Cycles

Reference designs

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Crosses

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