The MPC8555PXALF is a 32-bit microprocessor with a maximum operating frequency of 667MHz and a supply voltage of 1.2V. It is packaged in a flip chip ball grid array (FCBGA) with a 29x29mm footprint and 1mm pitch. The device is designed for surface mount applications and has an operating temperature range of 0°C to 105°C. Note that this device contains lead and is not RoHS compliant.
Frequency667MHz
PackageFCBGA
MountingSurface Mount
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Technical Specifications
NXP MPC8555PXALF technical specifications.
General
| Package/Case | FCBGA |
| Data Bus Width | 32b |
| Frequency | 667MHz |
| Halogen Free | Not Halogen Free |
| Lead Free | Contains Lead |
| Max Frequency | 667MHz |
| Max Operating Temperature | 105°C |
| Min Operating Temperature | 0°C |
| Max Supply Voltage | 1.26V |
| Min Supply Voltage | 1.14V |
| Mount | Surface Mount |
| Number of Cores | 1 |
| Operating Supply Voltage | 1.2V |
| Package Quantity | 180 |
| Packaging | Tray |
| RoHS Compliant | No |
| Series | MPC85xx |
| Weight | 0.152077oz |
Compliance
| RoHS | Not Compliant |
Datasheet
NXP MPC8555PXALF Datasheet
Download the complete datasheet for NXP MPC8555PXALF to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.
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