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Search Results for "EP4SGX530HH35C2ES"

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EP4SGX530HH35C2NES

FPGA 531.2K Logic Cells 40nm 1152-Pin BGA 8.5Gbps Transceivers

Ball Grid Array

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: FC-HFBGA

Package Description: Flip Chip Hybrid Fine Pitch Ball Grid Array

EP4SGX530HH35C3ES

IC FPGA 564 I/O 1152HBGA

Obsolete

Max Operating Temperature: 85°C

Min Operating Temperature: 0°C

Mount: Surface Mount

Number of I/Os: 564

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