TP2604-SR
3PEAK描述: | Dual/Quad, Ultra-low Distortion, 36V RRO Op-amps |
产地: | China |
推出日期: | Jun 25, 2015 |
更新:10-NOV-2024 | |
在线版本:https://www.datasheets.com/zh-cn/part-details/tp2604-sr-3peak-89635628
概述
熟悉该组件的基本一般信息、属性和特征，以及其与行业标准和法规的符合情况。
生命周期高级
欧盟RoHS Yes
RoHS版本2011/65/EU, 2015/863
EAR99
汽车 No
供应商CAGE代码Cage Code Not Available
8542330001
日程B8542330000
PPAP No
AEC认证 No
类别路径
Semiconductor > Linear > Amplifiers > Operational Amplifiers - Op Amps
Semiconductor > Linear > Amplifiers > Operational Amplifiers - Op Amps
技术资料
通过下载该电子元件的数据手册来全面了解其。这个PDF文档包含了所有必要的细节，如产品概述、特性、规格、评级、图表、应用等等。
数据表预览
(Latest 版本)封装
组件的包装信息提供了有关产品尺寸、重量和包装的重要细节。这有助于工程师确定产品是否符合其要求和期望。
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Supplier Package
Pin Count
PCB
Package Diameter (mm)
Package Material
Mounting
Package Outline
参数
参数信息显示了该组件的重要特性和性能指标，这有助于工程师和供应链经理比较和选择最适合其应用和需求的电子组件。
您必须登录才能查看受限信息。
生产线
Maximum Storage Temperature
Typical Input Resistance
Input Offset Voltage Drift
Typical Input Offset Current
Typical Input Bias Current
Typical Output Resistance
Typical High Level Output Voltage
Maximum Power Dissipation
Typical Settling Time
Shut Down Support
Power Supply Type
Supplier Temperature Grade
Typical Inverting Input Current Noise Density
Typical Noninverting Input Current Noise Density
Typical Slew Rate
Typical Input Noise Voltage Density
Minimum CMRR Range
Typical Voltage Gain
Maximum Input Voltage Range
Minimum Storage Temperature
Maximum Quiescent Current
Manufacturer Type
类型
Number of Channels per Chip
Rail to Rail
Output Type
Minimum Slew Rate
Typical Gain Bandwidth Product
Typical Low Level Output Voltage
Maximum Input Bias Current
Maximum Input Offset Voltage
Maximum Supply Current
Typical Output Current
Minimum Single Supply Voltage
Maximum Single Supply Voltage
Minimum Dual Supply Voltage
Maximum Dual Supply Voltage
Minimum CMRR
Minimum PSRR
Minimum Operating Temperature
Maximum Operating Temperature
Maximum Input Offset Current
Maximum Operating Supply Voltage
Typical Dual Supply Voltage
Typical Single Supply Voltage
Maximum Supply Voltage Range
Process Technology
CAD模型
访问组件的3D CAD模型、符号和封装。轻松可视化其结构和尺寸，集成设计并优化性能。