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Technical Specifications
Texas Instruments AM3352ZCE27 technical specifications.
General
| Package/Case | LFBGA |
| Contact Plating | Copper, Tin, Silver |
| Core Architecture | ARM |
| Data Bus Width | 32b |
| Frequency | 275MHz |
| Interface | I2C, SPI, USB, CAN, Ethernet, UART |
| Lead Free | Lead Free |
| Max Frequency | 275MHz |
| Max Operating Temperature | 90°C |
| Memory Type | ROM, RAM, |
| Min Operating Temperature | 0°C |
| Number of Cores | 1 |
| Operating Supply Voltage | 1.1V |
| Package Quantity | 160 |
| Packaging | Tray |
| Radiation Hardening | No |
| RAM Size | 64KB |
| RoHS Compliant | Yes |
| Series | Sitara™ |
| Voltage | 1.15V |
Compliance
| RoHS | Compliant |
Datasheet
Texas Instruments AM3352ZCE27 Datasheet
Download the complete datasheet for Texas Instruments AM3352ZCE27 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.
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