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Die Attach Materials
(56 个零件)优化您的搜索
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描述
符合ROHS标准
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H74
购买
CAD
Die Attach Materials
Two Component, Thermally Conductive Epoxy Designed For Hybrid Circuit Assembly Including Die Attach, Substrate Attach, Lid-Seal, Heat Dissipation, and Hermetic Sealing In General.
Yes
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P1011S
购买
CAD
Die Attach Materials
Single Component, Modified Polyimide, High Temperature Grade, Silver-Filled Electrically and Thermally Conductive Adhesive Designed For Semiconductor Die-Attach and Hybrid Microelectronic Packaging.
Yes
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E3001
购买
CAD
Die Attach Materials
One Component, Silver-Filled, Electrically Conductive Epoxy Designed For Semiconductor Die Attach Applications Using A Snap-Cure Profile.
Yes
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EK1000
购买
CAD
Die Attach Materials
Silver-Filled Adhesive That Exhibits Exceptional Thermal and Electrical Conductivity Along with A Shiny Silver Appearance Designed For The Demanding Requirements Of High Power Led Die Attach Applications
Yes
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EPO-TEK H65-175MP
购买
CAD
Die Attach Materials
Single Component, Alumina-Filled Epoxy For Military Hybrid Die and Component Attach
Yes
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E3001-HV
购买
CAD
Die Attach Materials
Snap Cure, Single Component, Silver-Filled Die Attach Adhesive For Semiconductor Plastic Ic Packaging
Yes
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TJ1183-LH
购买
CAD
Die Attach Materials
A Single Component, Low-Halogen, Electrically Insulating Die Attach Adhesive with Extended Pot Life
Yes
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