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Materials and Chemicals
Materials and Chemicals
Materials, Chemicals and Adhesives
Materials, Chemicals and Adhesives
Materials
Materials
Molding Compounds
Molding Compounds
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符合ROHS标准
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Hysol Huawei Electronics Co., Ltd
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符合ROHS标准
GR 360FA
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CAD
Hysol Huawei Electronics Co., Ltd
Molding Compounds
Green Mold Compound
GR 360
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CAD
Hysol Huawei Electronics Co., Ltd
Molding Compounds
Green Mold Compound
GR 646
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CAD
Hysol Huawei Electronics Co., Ltd
Molding Compounds
Mold Compound Material
MG15F-MOD2
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CAD
Hysol Huawei Electronics Co., Ltd
Molding Compounds
Very High Tg, Low Stress Epoxy Molding Compound
GR825-73B
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CAD
Hysol Huawei Electronics Co., Ltd
Molding Compounds
Epoxy Heat Cure Molding Compound
显示 1 至 25 的 5 个结果。
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