PackageFBGA
MountingSurface Mount
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Technical Specifications
Promos Technologies V55C2256164VBLK7 technical specifications.
General
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | FBGA |
| Package Description | Fine Pitch Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 54 |
| PCB | 54 |
| Package Length (mm) | 13 |
| Package Width (mm) | 8 |
| Package Height (mm) | 0.8(Max) |
| Seated Plane Height (mm) | 1.2(Max) |
| Pin Pitch (mm) | 0.8 |
| Package Material | Plastic |
| Mounting | Surface Mount |
Compliance
| EU RoHS | Yes |
| ECCN | EAR99 |
| RoHS Versions | 2002/95/EC |
Datasheet
Promos Technologies V55C2256164VBLK7 Datasheet
Download the complete datasheet for Promos Technologies V55C2256164VBLK7 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.