U-BOND Material Technology Co.,LTD

Dongguan U-bond Material Technology Co., Ltd. is a Sino-US joint venture, founded in 2003, specializing in researching,developing,producing and selling electronic&electrical adhesive sealing materials.U-bond is committed to providing customers with a comprehensive set of adhesive sealing material solutions. Our headquarters is located in Da Ling Shan Town, Dongguan City, under the jurisdiction of manufacturing base, research and development centers, analysis and testing center - including analysis and detection laboratory,reliability laboratory and application laboratory.