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Materials, Chemicals and Adhesives

Molding Compounds

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Fabricante:
Hysol Huawei Electronics Co., Ltd
GR 360FA
GR 360FA
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Hysol Huawei Electronics Co., Ltd
Molding Compounds
Green Mold Compound
GR 360
GR 360
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Hysol Huawei Electronics Co., Ltd
Molding Compounds
Green Mold Compound
GR 646
GR 646
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Hysol Huawei Electronics Co., Ltd
Molding Compounds
Mold Compound Material
MG15F-MOD2
MG15F-MOD2
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Hysol Huawei Electronics Co., Ltd
Molding Compounds
Very High Tg, Low Stress Epoxy Molding Compound
GR825-73B
GR825-73B
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Hysol Huawei Electronics Co., Ltd
Molding Compounds
Epoxy Heat Cure Molding Compound
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