Epoxy Adhesives
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P1011
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CAD
Epoxy Adhesives
Single Component, Modified Polyimide, Silver-Filled Adhesive Designed For Chip Bonding In Microelectronic and Optoelectronic Applications.
Yes
6067-3
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Epoxy Adhesives
A Single Component, Thermally Conductive, Electrically Insulating Epoxy Designed For Microelectronic Packaging and Assemblies
Yes
302-3M Black
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CAD
Epoxy Adhesives
Two Component Room Temperature Curing Epoxy Used For Optical, Medical, Fiber Optic, and Semiconductor Applications
Yes
383ND
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CAD
Epoxy Adhesives
Two Component, High Temperature, Electrically and Thermally Insulating Epoxy
Yes
EPO-TEK T905BN-4
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CAD
Epoxy Adhesives
Epoxy Adhesives Two Compound White/Light Mauve 12000Cps to 18000Cps >=4E14Ohm.cm
Yes
H54
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Epoxy Adhesives
Two Component, High Tg, Electrically and Thermally Insulating Epoxy Adhesive For General Bonding and High Temperature Packaging In Medical, Hybrid, and Optical Industries.
Yes
TJ2139-LH
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CAD
Epoxy Adhesives
Two Component, Electrically Insulating Epoxy Adhesive Designed To Meet Low Halogen Standards
Yes
EPO-TEK EJ2189
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Epoxy Adhesives
Epoxy Adhesives Two Compound Silver/Amber 25000Cps to 45000Cps <=0.0005Ohm.cm
Yes
377H
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CAD
Epoxy Adhesives
Two Component, High Tg, Graphite Filled Epoxy Designed For Esd/Emi Shielding Of Semiconductor Devices and Electronics
Yes
TZ101
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CAD
Epoxy Adhesives
Single Component, Electrically Insulating, Thermally Conductive Epoxy Adhesive Designed For Heat- Sinking Of Semiconductors, Hybrids, Electronics, and Optics
Yes
375
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CAD
Epoxy Adhesives
Two Component, High Temperature Epoxy Designed For Semiconductor, Hybrid, Fiber Optic, and Medical Applications
Yes
353ND BLACK
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CAD
Epoxy Adhesives
A Two Component, High Temperature Epoxy Designed For Semiconductor, Hybrid, Fiber Optic, and Medical Applications.
Yes
H20E-PFC
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CAD
Epoxy Adhesives
Epoxy Adhesives Two Compound Silver 3000cps to 4000cps <=0.0004Ohm.cm
Yes
H20E-SLR-HV
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CAD
Epoxy Adhesives
Two-Component, Electrically Conductive, Epoxy Adhesive Designed For Solar Ribbon Bonding Of Photovoltaic Modules
Yes
E4110-LV
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CAD
Epoxy Adhesives
Two Component, Silver-Filled Epoxy Used In Electronic and Circuit Assembly Applications In Semiconductor and Optical Industries
Yes
H20E-8
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CAD
Epoxy Adhesives
Two Component, Silver-Filled Epoxy System Designed Specifically For Chip Bonding In Microelectronic and Optoelectronic Applications
Yes
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