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Technical Specifications
NXP S9S12DG12F1MPVE technical specifications.
General
| Package/Case | LQFP |
| Core Architecture | HCS12 |
| Data Bus Width | 16b |
| Halogen Free | Halogen Free |
| Interface | I2C, SPI, CAN, SCI |
| Max Frequency | 25MHz |
| Max Operating Temperature | 105°C |
| Memory Size | 128KB |
| Memory Type | FLASH, |
| Min Operating Temperature | -40°C |
| Number of I/Os | 91 |
| Number of Programmable I/O | 91 |
| Oscillator Type | Internal |
| Package Quantity | 300 |
| Packaging | Tray |
| Peripherals | PWM, WDT |
| Radiation Hardening | No |
| RAM Size | 8KB |
| RoHS Compliant | Yes |
| Series | HCS12 |
| Weight | 0.045091oz |
Compliance
| RoHS | Compliant |
Datasheet
NXP S9S12DG12F1MPVE Datasheet
Download the complete datasheet for NXP S9S12DG12F1MPVE to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.