Quick Jump:
Technical Specifications
NXP S9S12DG12F1CPVE technical specifications.
General
| Package/Case | LQFP |
| Core Architecture | HCS12 |
| Interface | I2C, SPI, CAN, SCI |
| Max Operating Temperature | 85°C |
| Memory Size | 128KB |
| Memory Type | FLASH, |
| Min Operating Temperature | -40°C |
| Number of I/Os | 91 |
| Oscillator Type | Internal |
| Packaging | Tray |
| Peripherals | PWM, WDT |
| Radiation Hardening | No |
| RoHS Compliant | Yes |
| Series | HCS12 |
Compliance
| RoHS | Compliant |
Datasheet
NXP S9S12DG12F1CPVE Datasheet
Download the complete datasheet for NXP S9S12DG12F1CPVE to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.