16-bit CISC microcontroller featuring an HCS12X core, 80 MHz clock rate, and 512KB Flash program memory. This surface-mount device offers 32KB RAM, 117 programmable I/Os, and 8 timers. Connectivity includes 2 CAN, 2 I2C, and 1 SPI interface. Packaged in a 144-pin LQFP with a 0.5mm pitch, it operates from 2.5V to 5.5V and is rated for automotive applications with a temperature range of -40°C to 125°C.
PackageLQFP
MountingSurface Mount
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Technical Specifications
NXP S912XHZ512F1MAG technical specifications.
General
| Basic Package Type | Lead-Frame SMT |
| Package Family Name | QFP |
| Package/Case | LQFP |
| Package Description | Low Profile Quad Flat Package |
| Lead Shape | Gull-wing |
| Pin Count | 144 |
| PCB | 144 |
| Package Length (mm) | 20 |
| Package Width (mm) | 20 |
| Package Height (mm) | 1.45(Max) |
| Seated Plane Height (mm) | 1.6(Max) |
| Pin Pitch (mm) | 0.5 |
| Package Weight (g) | 1.3191 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Jedec | MS-026BFB |
| Family Name | HCS12 |
| Data Bus Width | 16bit |
| Instruction Set Architecture | CISC |
| Maximum Clock Rate | 80MHz |
| Maximum CPU Frequency | 80MHz |
| Device Core | HCS12X |
| Program Memory Type | Flash |
| Program Memory Size | 512KB |
| RAM Size | 32KB |
| Number of Programmable I/Os | 117 |
| Core Architecture | HCS12X |
| Programmability | Yes |
| Number of Timers | 8 |
| Interface Type | CAN/I2C/SCI/SPI |
| CAN | 2 |
| I2C | 2 |
| SPI | 1 |
| Ethernet | 0 |
| UART | 0 |
| USART | 0 |
| USB | 0 |
| I2S | 0 |
| Max Operating Supply Voltage | 2.75|5.5V |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 125°C |
| ADC Channels | 16 |
| Number of ADCs | Single |
Compliance
| Cage Code | H1R01 |
| EU RoHS | Yes |
| HTS Code | 8542310001 |
| Schedule B | 8542310000 |
| ECCN | 3A991.a.2 |
| Automotive | Yes |
| AEC Qualified | Yes |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Datasheet
NXP S912XHZ512F1MAG Datasheet
Download the complete datasheet for NXP S912XHZ512F1MAG to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.