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Technical Specifications
NXP P82B96PN-112 technical specifications.
General
| Package/Case | DIP |
| Interface | I2C, SMBus |
| Lead Free | Lead Free |
| Logic Function | Buffer |
| Max Operating Temperature | 85°C |
| Min Operating Temperature | -40°C |
| Max Power Dissipation | 300mW |
| Max Supply Voltage | 15V |
| Min Supply Voltage | 2V |
| Mount | Through Hole |
| Number of Input Lines | 4 |
| Number of Output Lines | 2 |
| Operating Supply Current | 900uA |
| Package Quantity | 50 |
| Packaging | Rail/Tube |
| Propagation Delay | 90ns |
| Radiation Hardening | No |
| Reach SVHC Compliant | No |
Compliance
| RoHS | Compliant |
Datasheet
NXP P82B96PN-112 Datasheet
Download the complete datasheet for NXP P82B96PN-112 to view detailed technical specifications.
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