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Technical Specifications
NXP MC68HC908MR8CDW technical specifications.
General
| Access Time | 8us |
| Package/Case | SOIC |
| Core Architecture | HC08 |
| Frequency | 8MHz |
| Halogen Free | Not Halogen Free |
| Interface | SCI |
| Lead Free | Contains Lead |
| Max Operating Temperature | 85°C |
| Memory Size | 8KB |
| Memory Type | FLASH |
| Min Operating Temperature | -40°C |
| Number of I/Os | 12 |
| Oscillator Type | Internal |
| Package Quantity | 26 |
| Packaging | Rail/Tube |
| Peripherals | POR, PWM, LVD |
| RAM Size | 256B |
| RoHS Compliant | No |
Compliance
| RoHS | Not Compliant |
Datasheet
NXP MC68HC908MR8CDW Datasheet
Download the complete datasheet for NXP MC68HC908MR8CDW to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.