CMOS Flash Programmable Logic Device (PLD) featuring 1700 macrocells and 2210 logic elements. This surface-mount component operates with a supply voltage range of 2.375V to 3.6V, typically 3.3V, and offers 272 I/O lines. It boasts a propagation delay of 7ns and a maximum operating frequency of 304MHz. The device is housed in a 324-ball fine-pitch ball grid array (FBGA) package, measuring 19mm x 19mm, and is lead-free and RoHS compliant.
Frequency3.01205GHz
PackageFBGA
MountingSurface Mount
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Technical Specifications
Intel EPM2210F324C3N technical specifications.
General
| Package/Case | FBGA |
| Frequency | 3.01205GHz |
| Lead Free | Lead Free |
| Max Frequency | 304MHz |
| Max Operating Temperature | 85°C |
| Max Supply Voltage | 3.6V |
| Memory Size | 8192b |
| Memory Type | FLASH, |
| Min Operating Temperature | 0°C |
| Min Supply Voltage | 2.375V |
| Mount | Surface Mount |
| Number of I/O Lines | 272 |
| Number of I/Os | 272 |
| Number of Logic Blocks (LABs) | 221 |
| Number of Logic Elements/Cells | 2210 |
| Number of Macrocells | 1700 |
| Operating Supply Current | 55mA |
| Operating Supply Voltage | 3.3V |
| Output Function | MACROCELL |
| Package Body Material | Plastic |
| Package Shape | Square |
| Packaging | Tray |
| Peak Reflow Temperature (Cel) | 260°C |
| Propagation Delay | 7ns |
| Radiation Hardening | No |
| RoHS Compliant | Yes |
| Series | MAX® II |
| Surface Mount | Yes |
| Temperature Grade | COMMERCIAL EXTENDED |
| Terminal Finish | Copper |
| Terminal Form | Ball |
| Terminal Position | BOTTOM |
| Time @ Peak Reflow Temperature-Max (s) | 40s |
| Turn-On Delay Time | 7ns |
| Width | 19mm |
Compliance
| RoHS | Compliant |
Datasheet
Intel EPM2210F324C3N Datasheet
Download the complete datasheet for Intel EPM2210F324C3N to view detailed technical specifications.
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