Stmicroelectronics
CPL-WB-02D3
RF Couplers Uni-directional Coupling 18dB 2.4GHz to 5.85GHz 5-Pin Flip-Chip T/R
PackageFlip-Chip
MountingSurface Mount
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Technical Specifications
Stmicroelectronics CPL-WB-02D3 technical specifications.
General
| Basic Package Type | Ball Grid Array |
| Package/Case | Flip-Chip |
| Pin Count | 5 |
| PCB | 5 |
| Package Length (mm) | 1.35 |
| Package Width (mm) | 1 |
| Package Height (mm) | 0.43 |
| Seated Plane Height (mm) | 0.63 |
| Pin Pitch (mm) | 0.45 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Type | Directional |
| Configuration | Uni-directional |
| Frequency Range | 2.4 to 5.85GHz |
| Module/IC Classification | IC |
| Maximum Insertion Loss | 0.5dB |
| Typical Coupling | 18dB |
| Min Operating Temperature | -30°C |
| Max Operating Temperature | 85°C |
| Impedance | 50Ohm |
Compliance
| Cage Code | SCR76 |
| EU RoHS | Yes |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Datasheet
Stmicroelectronics CPL-WB-02D3 Datasheet
Download the complete datasheet for Stmicroelectronics CPL-WB-02D3 to view detailed technical specifications.
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