PackageDIP
Capacitance100nF
MountingThrough Hole
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Technical Specifications
TDK B32560J1104J189 technical specifications.
General
| Capacitance | 100nF |
| Package/Case | DIP |
| Construction | RADIAL |
| Contact Plating | Tin, Matte |
| Depth | 2.5mm |
| Dielectric | PET |
| Dielectric Material | PET |
| Lead Diameter | 0.5mm |
| Lead Pitch | 7.5mm |
| Length | 9mm |
| Max Operating Temperature | 100°C |
| Min Operating Temperature | -55°C |
| Mount | Through Hole |
| Package Quantity | 12400 |
| Packaging | Tape and Reel |
| Series | SilverCap™ B32560 |
| Termination | Radial |
| Tolerance | 5% |
| Type | General Purpose |
| Voltage Rating (AC) | 63V |
| DC Rated Voltage | 100V |
Compliance
| RoHS | Compliant |
Datasheet
TDK B32560J1104J189 Datasheet
Download the complete datasheet for TDK B32560J1104J189 to view detailed technical specifications.
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