Airborn
M55302/58LB60Y-11
60-Contact RCP Wire to Board Header, 1.27mm Pitch, 2-Row, Through Hole Mount
The M55302/58LB60Y-11 is a 60-contact wire to board header from Airborn, designed for RCP connections. It features a 1.27mm terminal pitch and a 2-row configuration. The header is suitable for through hole mounting and has a maximum operating temperature range of -65°C to 125°C. With a height of 11.81mm, it is a compact solution for board-to-board connections.
MountingThrough Hole
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Technical Specifications
Airborn M55302/58LB60Y-11 technical specifications.
General
| Type | Wire to Board |
| Gender | RCP |
| Number of Contacts | 60 |
| Terminal Pitch | 1.27mm |
| Number of Rows | 2 |
| Termination Method | Solder |
| Min Operating Temperature | -65°C |
| Max Operating Temperature | 125°C |
| Body Orientation | Straight |
| Mounting | Through Hole |
| Max Current Rating | 5A |
| Height | 11.81mm |
Compliance
| RoHS Version | 2002/95/EC |
Datasheet
Airborn M55302/58LB60Y-11 Datasheet
Download the complete datasheet for Airborn M55302/58LB60Y-11 to view detailed technical specifications.
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