EPM2210GF256C3N

EPM2210GF256C3N

Intel

Description:

CPLD MAX® II Family 1700 Macro Cells 304MHz 0.18um Technology 1.8V 256-Pin FBGA Tray

Introduction date:

Dec 21, 2004

Updated:27-OCT-2024

CAD ModelsRef. Designs

Overview

Familiarize yourself with the fundamental general information, properties, and characteristics of the component, along with its compliance with industry standards and regulations.

LifeCyclePremium
EU RoHS Yes
RoHS Version2011/65/EU, 2015/863
3A991
Automotive No
Supplier Cage Code4BA62
8542310055
Schedule B8542310055
PPAP No
AEC Qualified No
Category Path
Semiconductor > Programmable Devices > Programmable Logic Devices > Complex Programmable Logic Devices - CPLDs

Datasheet

Get a comprehensive understanding of the electronic component by downloading its datasheet. This PDF document includes all the necessary details, such as product overview, features, specifications, ratings, diagrams, applications, and more.

Datasheet Preview

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Package

The package information for the component gives important details about the product's size, weight, and packaging. This helps engineers determine if the product meets their requirements and expectations.

Basic Package Type
Package Family Name
Supplier Package
Package Description
Lead Shape
Pin Count
PCB
Package Diameter (mm)
Package Material
Mounting
Package Outline
Package Overall Height (mm)
Package Overall Width (mm)
Package Overall Length (mm)
Jedec
Jedec info (PKG outline)

Manufacturing

The manufacturing information specifies the technical requirements and specifications for producing and assembling the component. This information is crucial for manufacturers to maintain the quality and reliability of the components, and ensure they are compatible with other devices and components.

Reflow Temp. Source

Parametric

The parametric information displays vital features and performance metrics of the component, which helps engineers and supply chain managers to compare and choose the most appropriate electronic component for their applications and needs.

Product Line
Programmable Type
Maximum Internal Frequency
Maximum Clock to Output Delay
Number of Global Clocks
Maximum Operating Frequency
Tolerant Configuration Interface Voltage
Memory Size
Number of I/O Banks
Number of Inter Dielectric Layers
Data Gate
Minimum Storage Temperature
I/O Voltage
Maximum Storage Temperature
Copy Protection
Individual Output Enable Control
Reprogrammability Support
Maximum Operating Current
Temperature Flag
Device System Gates
Supplier Temperature Grade
Tradename
Maximum Propagation Delay Time
Clock Management
Family Name
Device Logic Cells
RAM Bits
Number of User I/Os
Speed Grade
Number of Product Terms per Macro
Number of Logic Blocks/Elements
Number of Macro Cells
Number of Flip Flops
Program Memory Type
Maximum Operating Supply Voltage
Process Technology
Minimum Operating Temperature
Maximum Operating Temperature
Minimum Operating Supply Voltage
Typical Operating Supply Voltage
Programmability
In-System Programmability

Reference designs

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CAD Models

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Crosses

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