PackageDSBGA
MountingSurface Mount
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Technical Specifications
Texas Instruments TPS659122YFFT technical specifications.
General
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | DSBGA |
| Package Description | Die Size Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 81 |
| PCB | 81 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Function | Application Processors |
| Input Voltage | 2.7 to 5.5V |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 85°C |
Compliance
| Cage Code | 01295 |
| EU RoHS | Yes |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Datasheet
Texas Instruments TPS659122YFFT Datasheet
Download the complete datasheet for Texas Instruments TPS659122YFFT to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.