XSoft thermal interface material, a silicone-based putty, offers a thermal conductivity of 3 W/mK. Designed for general thermal management applications, this white, square-shaped material features a thickness of 0.06 inches. It operates effectively across a wide temperature range, from -45°C to 200°C, with a natural thermal resistance of 0.53°C/W.
Package502
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Technical Specifications
Laird A10235-31 technical specifications.
General
| Package/Case | 502 |
| Color | White |
| Material | Silicone |
| Max Operating Temperature | 200°C |
| Min Operating Temperature | -45°C |
| Natural Thermal Resistance | 0.53°C/W |
| Package Quantity | 1 |
| Series | TPutty™ 502 |
| Shape | Square |
| Thickness | 0.06inch |
Compliance
| RoHS | Compliant |
Datasheet
No datasheet is available for this part.
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