Epoxy Adhesives
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P1011
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CAD
Epoxy Adhesives
Single Component, Modified Polyimide, Silver-Filled Adhesive Designed For Chip Bonding In Microelectronic and Optoelectronic Applications.
Yes
6067-3
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CAD
Epoxy Adhesives
A Single Component, Thermally Conductive, Electrically Insulating Epoxy Designed For Microelectronic Packaging and Assemblies
Yes
302-3M Black
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CAD
Epoxy Adhesives
Two Component Room Temperature Curing Epoxy Used For Optical, Medical, Fiber Optic, and Semiconductor Applications
Yes
383ND
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CAD
Epoxy Adhesives
Two Component, High Temperature, Electrically and Thermally Insulating Epoxy
Yes
354
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CAD
Epoxy Adhesives
Two Component, High Tg Epoxy Designed For Semiconductor Packaging In Medical, Fiber Optic And Optoelectronic Assemblies
Yes
509FM-1
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CAD
Epoxy Adhesives
Two Component, Optically Opaque Epoxy Designed For Potting Of Semiconductors, Pcb and Systems-Level Electronics
Yes
353ND
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CAD
Epoxy Adhesives
Epoxy Adhesives Two Compound Clear/Amber 3000cps to 5000cps >=1.8x10^13Ohm.cm
Yes
H70E
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CAD
Epoxy Adhesives
Epoxy Adhesives Two Compound Grey/Beige 4000cps to 7000cps >=1x10^13Ohm.cm
Yes
EPO-TEK 301-2
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CAD
Epoxy Adhesives
Epoxy Adhesives Two Compound Clear/Colorless 225cps to 425cps >=2x10^12Ohm.cm
Yes
EPO-TEK T905BN-4
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CAD
Epoxy Adhesives
Epoxy Adhesives Two Compound White/Light Mauve 12000Cps to 18000Cps >=4E14Ohm.cm
Yes
H54
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CAD
Epoxy Adhesives
Two Component, High Tg, Electrically and Thermally Insulating Epoxy Adhesive For General Bonding and High Temperature Packaging In Medical, Hybrid, and Optical Industries.
Yes
TJ2139-LH
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CAD
Epoxy Adhesives
Two Component, Electrically Insulating Epoxy Adhesive Designed To Meet Low Halogen Standards
Yes
EPO-TEK EJ2189
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CAD
Epoxy Adhesives
Epoxy Adhesives Two Compound Silver/Amber 25000Cps to 45000Cps <=0.0005Ohm.cm
Yes
377H
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CAD
Epoxy Adhesives
Two Component, High Tg, Graphite Filled Epoxy Designed For Esd/Emi Shielding Of Semiconductor Devices and Electronics
Yes
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