Airborn
M55302/64-B60Y-53
60-Contact RCP Wire-to-Board Header, 1.27mm Pitch, 2 Rows, Through Hole Mount
The Airborn M55302/64-B60Y-53 is a 60-contact wire-to-board header with a right-angle contact position and a terminal pitch of 1.27mm. It features a straight body orientation and is designed for through-hole mounting. The header operates reliably within a temperature range of -65°C to 125°C and can handle a maximum current rating of 5A. The Airborn M55302/64-B60Y-53 is suitable for use in a variety of applications, including board-to-board and mezzanine connections.
MountingThrough Hole
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Technical Specifications
Airborn M55302/64-B60Y-53 technical specifications.
General
| Type | Wire to Board |
| Gender | RCP |
| Number of Contacts | 60 |
| Terminal Pitch | 1.27mm |
| Number of Rows | 2 |
| Termination Method | Solder |
| Min Operating Temperature | -65°C |
| Max Operating Temperature | 125°C |
| Body Orientation | Straight |
| Mounting | Through Hole |
| Max Current Rating | 5A |
| Height | 11.81mm |
Compliance
| RoHS Version | 2002/95/EC |
Datasheet
Airborn M55302/64-B60Y-53 Datasheet
Download the complete datasheet for Airborn M55302/64-B60Y-53 to view detailed technical specifications.
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