GS4576C36GL-18T

GS4576C36GL-18T

GSI Technology
Description:

DRAM Chip LLDRAM 576Mbit 16Mx36 1.8V 144-Pin MBGA T/R

Country of Origin: Taiwan (Province of China)
Introduction date:May 2, 2011

Updated: 27-NOV-2024

Overview

Familiarize yourself with the fundamental general information, properties, and characteristics of the component, along with its compliance with industry standards and regulations.

LifeCyclePremium
EU RoHS Yes
RoHS Version2011/65/EU, 2015/863
3A991.b.2.a
Automotive No
Supplier Cage Code3BKC7
8542320041
Schedule B8542320040
PPAP No
AEC Qualified No
Category Path
Semiconductor > Memory > Memory Chips > DRAM Chip

Datasheet

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Manufacturing

The manufacturing information specifies the technical requirements and specifications for producing and assembling the component. This information is crucial for manufacturers to maintain the quality and reliability of the components, and ensure they are compatible with other devices and components.

Reflow Temp. Source
Lead Finish(Plating)
Terminal Base Material

Crosses

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