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Technical Specifications
NXP BGA2022,115 technical specifications.
General
| Package/Case | TSSOP |
| Frequency | 900MHz |
| Gain | 8dB |
| Lead Free | Lead Free |
| Max Operating Temperature | 150°C |
| Max Power Dissipation | 40mW |
| Noise Figure | 12dB |
| Operating Frequency | 0.9 to 2.4 GHz |
| Operating Supply Current | 10mA |
| Package Quantity | 1 |
| Packaging | Tape and Reel |
| Power Dissipation | 40mW |
| Power Gain | 8dB |
| Radiation Hardening | No |
| RoHS Compliant | Yes |
| Series | BGA2022 |
Compliance
| RoHS | Compliant |
Datasheet
NXP BGA2022,115 Datasheet
Download the complete datasheet for NXP BGA2022,115 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.
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