Die Attach Materials
(56 Parts)
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ROHS
P1011S
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CAD
Die Attach Materials
Single Component, Modified Polyimide, High Temperature Grade, Silver-Filled Electrically and Thermally Conductive Adhesive Designed For Semiconductor Die-Attach and Hybrid Microelectronic Packaging.
Yes
E3001
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CAD
Die Attach Materials
One Component, Silver-Filled, Electrically Conductive Epoxy Designed For Semiconductor Die Attach Applications Using A Snap-Cure Profile.
Yes
EK1000
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CAD
Die Attach Materials
Silver-Filled Adhesive That Exhibits Exceptional Thermal and Electrical Conductivity Along with A Shiny Silver Appearance Designed For The Demanding Requirements Of High Power Led Die Attach Applications
Yes
E3001-HV
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CAD
Die Attach Materials
Snap Cure, Single Component, Silver-Filled Die Attach Adhesive For Semiconductor Plastic Ic Packaging
Yes
TJ1183-LH
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CAD
Die Attach Materials
A Single Component, Low-Halogen, Electrically Insulating Die Attach Adhesive with Extended Pot Life
Yes
H70E-2
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CAD
Die Attach Materials
Two Component, Thermally Conductive Electrically Insulating Epoxy Designed For Glob-Top Chip Protection In Tab and Cob Die-Attach Technologies
Yes
TJ1104-LH
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CAD
Die Attach Materials
A Black, Single Component, Low Halogen, Electrically Insulating Die Attach Adhesive with Extended Pot Life
Yes
H35-175MP
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CAD
Die Attach Materials
Single Component, Silver-Filled Epoxy For Military Hybrid Die and Component Attach
Yes
H65-175MP
Buy
CAD
Die Attach Materials
Single Component, Alumina-Filled Epoxy For Military Hybrid Die and Component Attach
Yes
EPO-TEK H65-175MP
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CAD
Die Attach Materials
Single Component, Alumina-Filled Epoxy For Military Hybrid Die and Component Attach
Yes
EPO-TEK H35-175MP
Buy
CAD
Die Attach Materials
Single Component, Silver-Filled Epoxy For Military Hybrid Die and Component Attach
Yes
E3035
Buy
CAD
Die Attach Materials
Single Component, Silver-Filled Epoxy For Hybrid Die and Component Attach
Yes
E3001-6
Buy
CAD
Die Attach Materials
Single Component, Electrically and Thermally Conductive, Snap Cure, Die Attach Epoxy
Yes
H24
Buy
CAD
Die Attach Materials
Two Component, Electrically and Thermally Conductive Epoxy Adhesive Designed For Semiconductor Die Attach and Hybrid Micro-Electronics Assembly.
Yes
EK2000
Buy
CAD
Die Attach Materials
Two Component, Silver-Filled Adhesive That Exhibits Exceptional Thermal and Electrical Conductivity Along with A Shiny Silver Appearance Making It Ideal For The Demanding Requirements Of High Power Led Die Attach Applications
Yes
H74
Buy
CAD
Die Attach Materials
Two Component, Thermally Conductive Epoxy Designed For Hybrid Circuit Assembly Including Die Attach, Substrate Attach, Lid-Seal, Heat Dissipation, and Hermetic Sealing In General.
Yes
H35-175MPT
Buy
CAD
Die Attach Materials
Single Component, Silver-Filled Epoxy For Military Hybrid Die and Component Attach
Yes
H35-175MPLV
Buy
CAD
Die Attach Materials
Single Component, Silver-Filled Epoxy For Military Hybrid Die and Component Attach
Yes
H31
Buy
CAD
Die Attach Materials
Single Component, Silver-Filled, Electrically Conductive Epoxy Designed For Semiconductor Die Attach Applications Found In Hybrids, Jedec, and Opto-Electronic Packaging.
Yes
H31LV
Buy
CAD
Die Attach Materials
Single Component, Silver-Filled, Electrically Conductive Epoxy Designed For Semiconductor Die Attach Applications Found In Hybrids, Jedec, and Opto-Electronic Packaging
Yes
H67-MP
Buy
CAD
Die Attach Materials
Single Component, Thermally Conductive Epoxy For Hybrid Die and Component Attach
Yes
EM127
Buy
CAD
Die Attach Materials
Single Component, Heat Curable, Electrically Conductive Epoxy Adhesive For Semiconductor Ic and Led Die Attach Applications.
Yes
Showing 1 to 25 of 25 results