PackageTSSOP
MountingSurface Mount
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Technical Specifications
Stmicroelectronics TSC1031IYPT technical specifications.
General
| Basic Package Type | Lead-Frame SMT |
| Package Family Name | SOP |
| Package/Case | TSSOP |
| Package Description | Thin Shrink Small Outline Package |
| Lead Shape | Gull-wing |
| Pin Count | 8 |
| PCB | 8 |
| Package Length (mm) | 3 |
| Package Width (mm) | 4.4 |
| Package Height (mm) | 1 |
| Seated Plane Height (mm) | 1.2(Max) |
| Pin Pitch (mm) | 0.65 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Jedec | MO-153AA |
| Type | Current Sense Amplifier |
| Number of Elements per Chip | 1 |
| Number of Channels per Chip | 1 |
| Maximum Input Offset Voltage | 0.5@5VmV |
| Maximum Input Bias Current | 0.015@5V@-40C to 125CuA |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 125°C |
Compliance
| Cage Code | SCR76 |
| EU RoHS | Yes |
| HTS Code | 8542330001 |
| Schedule B | 8542330000 |
| ECCN | EAR99 |
| Automotive | Yes |
| AEC Qualified | Yes |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Datasheet
Stmicroelectronics TSC1031IYPT Datasheet
Download the complete datasheet for Stmicroelectronics TSC1031IYPT to view detailed technical specifications.
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