Datasheets
Materials, Chemicals and Adhesives

Molding Compounds

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Fabricant:
Hysol Huawei Electronics Co., Ltd
GR 360FA
GR 360FA
Acheter
CAD
pdf
Hysol Huawei Electronics Co., Ltd
Molding Compounds
Green Mold Compound
GR 360
GR 360
Acheter
CAD
pdf
Hysol Huawei Electronics Co., Ltd
Molding Compounds
Green Mold Compound
GR 646
GR 646
Acheter
CAD
pdf
Hysol Huawei Electronics Co., Ltd
Molding Compounds
Mold Compound Material
MG15F-MOD2
MG15F-MOD2
Acheter
CAD
pdf
Hysol Huawei Electronics Co., Ltd
Molding Compounds
Very High Tg, Low Stress Epoxy Molding Compound
GR825-73B
GR825-73B
Acheter
CAD
pdf
Hysol Huawei Electronics Co., Ltd
Molding Compounds
Epoxy Heat Cure Molding Compound
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